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Your position: Home > Repair Tools > Soldering Tools > Reballing Stencil > Japan Steel BGA Stencil for Samsung S9 S9+ Exynos9810 SDM845 CPU Heat Planting Tin Net 0.12mm Thickness Template

Japan Steel BGA Stencil for Samsung S9 S9+ Exynos9810 SDM845 CPU Heat Planting Tin Net 0.12mm Thickness Template

24930561

(0 Reviews)

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Description

Japan Steel BGA Stencil for Samsung S9 S9+ Exynos9810 SDM845 CPU Heat Planting Tin Net 0.12mm Thickness Template

Description:
High quality BGA Stencil.
Specially designed for Samsung S9 S9+ Exynos9810 SDM845 CPU
Make your repair work easier.
Material: Stainless Steel 
Thickness:0.12mm

Japan Steel BGA Stencil for Samsung S9 S9+ Exynos9810 SDM845 CPU Heat Planting Tin Net 0.12mm Thickness TemplateJapan Steel BGA Stencil for Samsung S9 S9+ Exynos9810 SDM845 CPU Heat Planting Tin Net 0.12mm Thickness TemplateJapan Steel BGA Stencil for Samsung S9 S9+ Exynos9810 SDM845 CPU Heat Planting Tin Net 0.12mm Thickness Template

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    Japan Steel BGA Stencil for Samsung S9 S9+ Exynos9810 SDM845 CPU Heat Planting Tin Net 0.12mm Thickness Template

    Japan Steel BGA Stencil for Samsung S9 S9+ Exynos9810 SDM845 CPU Heat Planting Tin Net 0.12mm Thickness Template

    $3.20