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Description
1. Compatible with chips smaller than 20mm x 18.5mm, suitable for more than 99% chips on the market.
2. One-button heating, rapid heating, adjustable temperature range of 160-250°C, suitable for the removal of glue and tin from multiple generations of iPhones and Huawei chips.
3. No need for solder wick, residual solder can be easily cleaned using a cotton swab, without damaging the solder pads.
4. Heating without a hot air gun, temperature is 100 degrees lower than that of a hot air gun, making glue or tin removal safer.
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