Qianli 4 IN 1 Middle Layer Frame BGA Reballing Stencil Motherboard Planting Tin Platform for iPhone 13/13Pro/13Pro Max/13Mini

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$16.90

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Qianli 4 IN 1 Middle Layer Frame BGA Reballing Stencil Motherboard Planting Tin Platform for iPhone 13/13Pro/13Pro Max/13Mini

Name: Qianli 4 IN 1 Middle Layer Frame BGA Reballing Stencil Motherboard Planting Tin Platform for iPhone 13/13Pro/13Pro Max/13Mini
Price: 16.90 USD

Description :
--4 IN 1 Middle Frame Reballing Platform
--Strong magnetic adsorption, Tin planting fastly.
--Double sided use, Precision Positioning.
--Material : High hardness synthetic stone.Steel
--Size: 102mm*62mm*11mm
--Support for iPhone 13/13Pro/13Pro Max/13Mini .

Operation Steps :
--1.Put the Motherboard into the corresponding groove, and quickly locate the corresponding position according to the auxiliary line.
--2.Align the stencils of the corresponding model to it.
--3.Apply low temperature solder paste evenly on the stencil mesh.
--4.Remove the stencil after the application of the solder paste, Do not to blow the stencil directly with a hot air gun.
--5.After removing the stencil, use a hot air gun to heat and blow until the solder paste melts

Package :
1 * BGA Reballing Platform