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Description
1. Excellent Thermal Conductivity: The insulation pad provides superior thermal conductivity to dissipate
heat rapidly during motherboard repairs and chip swaps or replacements to prevent component overheating.
2. Ensuring the Safety of Surrounding Components: This insulation pad protects surrounding components from high temperatures during the repair process.600℃ (Max.) Temperature Resistance: Withstanding temperatures of up to 600 °C, it is particularly useful for almost all repair environments.
3. Thermal Conductivity Coefficient: An excellent thermal conductivity coefficient of 0.012 indicates the material's ability to conduct heat.